RoHS第四批豁免清单征求意见稿

1.  On-Semi MCR265-10 SCR;(安森美MCR265-10 SCR)

2.  Components NEC V55;(NEC V55元件)

3.  The use of lead in solder applications for electronic components of musical instruments having an average lifespan in excess of 10 years;(应用于使用寿命超过10年的电子乐器中的铅焊料)

4.  Lead solder alloy in Surge protective devices (SPDs);(浪涌保护器中的铅焊料合金)

5.  Inventory of Special ICs having tin-lead solder on/in leads/balls, used in specialist/professional equipment;(用在特殊/专业设备上的引脚/球栅含有铅锡焊料的库存特殊集成电路)

6.  Lead alloys as electrical/mechanical solder for transducers used in high-powered professional and commercial loudspeakers;(大功率专业和商用扩音器中的变频器中作为电子/机械焊料的铅合金)

7.  Solder containing lead for applications where the local temperature exceeds 150 C and reliable operation for a minimum of 30,000 hours is required;(局部温度超过150℃，可靠工作时间最少30，000小时的应用中所要求的含铅焊料)

8.  Tin-lead solder in the manufacture of professional audio equipment;(专业音响设备制造中使用的锡铅焊料)

9.  Specific modular units including tin-lead solder being used in special professional equipment;(用于特殊专业设备的特殊模块单元中包括的锡铅焊料)

10.  Lead in electronic vacuum tubes;(电子真空管中的铅)

11.  Lead in aluminium used in gas valves for domestic cooking appliances;(煤气阀所使用的铝中的铅)

12.   Cadmium and its compounds in electrical contacts except for applications of one-shot operation function such as thermal links and cadmium plating except for the applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to the restriction on the marketing and use of certain dangerous substances and preparations.”;(电触点中的隔及其化合物，一次性使用例如热熔断体除外，以及91/338/EEC指令的修正指令76/769/EEC禁 止以外的镉电镀中的隔及其化合物)

13.  Lead in solder of parts recovered from gaming/amusement machines put on the market before 1/07/06 and reused for the same purpose within a manufacturer’s closed loop until July 2014;(已于2006年7月1日前投放市场的游戏/娱乐机器的回收零件所使用焊料中的铅，以及截至2014年7月生产厂商的闭环系统就回收目的供再利 用的零件所使用焊料中的铅)

14.  Lead in solders in components and assemblies used in non-consumer products, provided that: - such components and assemblies were purchased or are subject to a proven last-time buy contract placed before 1 July, 2006; and - such components and assemblies are used in models of EEE that were already available on the market before 1 July 2006;(非消费品中的元器件和装配件所使用焊料中的铅，例如：在2006年7月1日前购买或合约最后购买期限在2006年7月1日前的元器件和装配 件；2006年7月1日前上市的电子电器设备模具中的元器件和装配件)

15.  Cadmium plating as defined in Directive 91/338/EEC except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations.”(在91/338/EEC指令中定义的隔电镀，但不包括91/338/EEC指令的修正指令76/769/EEC禁止的用途)